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一,序言晶体管发明以来的近25年间,半导体科学进展甚为迅速。以晶体管为主的半导体部件取代了电子管,单个器件发展成具有电路功能的集成电路,现正向具有大功能的LSI(大规模集成电路)发展。另一方面CCD(电荷耦合器件)和结构简单的功能器件(耿效应器件,光耦合器件等)也在发展,而且正在探讨其集成化的可能性。对于半导体科学的发展,国际上的竞争日益激烈,随着单个器件、IC、LSI的性能(功率、速度、可靠性等)的提高,在技术上强烈要求解决降低成本的问题。现在半导体材料以硅为主,伴随其使用量的激增,正在实行片子大型化、优质化和工艺过程自动化等。
First, the preface The transistor since the invention of the past 25 years, the progress of semiconductor science is very fast. The transistor-based semiconductor components to replace the tube, a single device into a circuit function of the integrated circuit, is now having a large function of the LSI (large scale integrated circuits) development. On the other hand, CCDs (Charge Coupled Devices) and simple functional devices (Gn effect devices, optical coupling devices, etc.) are also being developed and their integration possibilities are being explored. For the development of semiconductor science and technology, the international competition is fiercer and fiercer. With the improvement of the performance (power, speed, reliability, etc.) of single devices, ICs and LSIs, the problem of cost reduction is strongly required in the art. Now the main semiconductor materials to silicon, with the surge in its use of large-scale film is being implemented, high quality and process automation.