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日本半导体(芯片)、液晶技术研发机构日本半导体能源研究所(SEL、Semiconductor Energy Laboratory)已研发出可将耗电力压缩至现行1/10以下水准的下代芯片量产技术,且台湾晶圆代工大厂联电将抢先在2016年夏天开始生产采用上述技术的CPU、存储器产品。报导指出,SEL舍弃现行主流的硅、改用IGZO的氧化物半导体的特殊结晶体,借由形成多层电子电路(electronic circuit)、防止电流外漏,借此达到省电的效果,除可大幅改善智能手机等电子机器的电池寿命之外,也有望促进智能手
Japan Semiconductor (chip), liquid crystal technology research and development institute Japan Semiconductor Energy Laboratory (SEL), Semiconductor Energy Laboratory has developed a power consumption can be compressed to the current level of 1/10 below the next generation chip production technology, and Taiwan wafer OEM maker UMC will be the first to start in the summer of 2016 using the above technology CPU, memory products. The report pointed out that SEL discarded the current mainstream of silicon, switch to IGZO’s oxide semiconductor special crystal, by the formation of multi-layer electronic circuits (electronic circuits), to prevent current leakage, in order to achieve the power saving effect, in addition to significantly improve In addition to the battery life of electronic devices such as smartphones, smartphones are also expected to be promoted