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“中国硅知识产权产业联盟”将在北京正式成立。联盟由信息产业部软件与集成电路促进中心(CSIP)、中芯国际、中星微电子、神州龙芯、苏州国芯、大唐微电子、智芯科技、海信等单位发起。首批加盟的企事业单位有51家,包括国内各地IC设计企业、科研机构、国内外硅知识产权(IP核)提供商、世界著名EDA工具提供商以及IC制造企业。Tensilica公司于2005年8月23日正式宣布加入 “中国硅知识产权产业联盟”。
“China Silicon Intellectual Property Industry Alliance ” will be formally established in Beijing. Alliance by the Ministry of Information Industry Software and Integrated Circuit Promotion Center (CSIP), SMIC, Vimicro, Shenzhou Godson, Suzhou Guoxin, Datang Microelectronics, Chi-core technology, Hisense and other units launched. The first enterprises and institutions to join 51, including all over the IC design enterprises, research institutions, domestic and foreign silicon intellectual property (IP nuclear) providers, the world’s leading EDA tool providers and IC manufacturing enterprises. Tensilica Corporation officially announced on August 23, 2005 to join “China Silicon Intellectual Property Industry Alliance.”