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【摘 要】
：
The solder joint reliability of a 0. 5 mm lead pitch, 240-pin quad flat package(QFP) was studied by nonlinear finite element analysis(FEA). The stress/strain di
【机 构】
：
School of Electro-Mechanical Engineering,Department of Electronic Machinery and Transportation Engin
【出 处】
：
中国有色金属学会会刊（英文版）
【发表日期】
：
2004年期
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