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Thermal management in microelectronic technology has become an important issue due to the increase of device power and integration levels.Diamond and silver were selected for the fabrication of composites with high thermal conductivity and low coefficient of thermal expansion (CTE).Diamond reinforcement powders with varied types, shapes and sizes were wet ball-mixed by silver.Then these powders were hot-pressed in air at 600 ℃, 500 MPa, for 30 minutes to produce bulk silver matrix composites.