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在传统硫酸沉积铜中甲烷磺酸是一种可选择的电解液。从环境友好的乙酸基电解液中电沉积铜,该电解液由乙酸铜、乙酸钠、甲烷磺酸组成。采用维生素、糖精和4-氨基-3-羟基-1-磺酸作为沉积电解液的添加剂,利用法拉第定律计算阴极电流效率,并使用Haring-Blum电池确定溶液中的金属分布比。这些添加剂影响了沉积铜薄膜的表面形貌,采用SEM和XRD手段分析其晶粒尺寸。XRD谱表明电沉积铜是多晶面心立方体结构。采用Debye-Scherrer公式计算薄膜的晶粒大小。晶体尺寸表明含电解液添加剂沉积得到的产物具有最小的晶粒尺寸。织构系数分析表明,所有的铜沉积膜都是多晶结构,晶体择优取向并平行于表面。添加剂导致了均匀的无针孔表面形貌和晶粒细化。
Methanesulfonic acid is an alternative electrolyte in conventional sulfate-deposited copper. Copper is electrodeposited from an environmentally friendly, acetate-based electrolyte consisting of copper acetate, sodium acetate, and methanesulfonic acid. Cathodic current efficiency was calculated using Faraday’s law with vitamins, saccharin and 4-amino-3-hydroxy-1-sulfonic acid as deposition electrolyte and Haring-Blum cells were used to determine the metal distribution ratio in solution. These additives affect the surface morphology of the deposited copper films, and their grain sizes were analyzed by SEM and XRD. XRD patterns indicate that electrodeposited copper is polycrystalline face-centered cubic structure. The Debye-Scherrer formula was used to calculate the grain size of the film. The crystal size indicates that the product deposited with the electrolyte additive has the smallest grain size. The texture coefficient analysis shows that all of the copper-deposited films are polycrystalline and the crystals are preferentially oriented and parallel to the surface. Additives result in a uniform pinhole-free surface morphology and grain refinement.