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采用单室Gasar工艺,通过实验研究和Procast凝固模拟相结合,研究了坩埚抽拉速率对凝固界面形貌、铸锭平均凝固速率、藕状多孔Cu气孔形貌、气孔生长方向以及相应多孔结构参数的影响规律.研究表明,随着抽拉速率的升高,凝固界面从凸界面向平界面再向凹界面演化.当凝固界面为凸界面和凹界面时,气孔生长方向都会偏离铸锭抽拉方向.而只有在合适的抽拉速率条件下使凝固界面以平界面方式推进,才能获得气孔完全平直生长的优质藕状多孔Cu.实验和模拟结果显示,在本实验条件下,当抽拉速率为1 mm/s时,铸锭凝固界面基本以平界面方式推进;藕状多孔Cu铸锭的气孔率不受抽拉速率的影响,但随着抽拉速率的增大,平均孔径和通孔率会逐渐降低.
Single-chamber Gasar technology was used to study the relationship between the rate of solidification and the solidification interface, the average solidification rate of ingot, the stomatal characteristics, the growth direction of pores and the corresponding porous structure parameters .The results show that the solidification interface evolves from the convex interface to the flat interface and then to the concave interface with the increase of the drawing rate.When the solidified interface is the convex interface and the concave interface, Only when the solidification interface is propelled by a flat interface under suitable drawing rate can the pure lotus-shaped porous Cu with stomatal complete and straight growth be obtained.Experimental and simulation results show that under the experimental conditions, when the drawing rate 1 mm / s, the solidified interface of the ingot basically advances in a flat interface mode. The porosity of the lotus-shaped porous Cu ingot is not affected by the drawing speed, but with the increase of the drawing speed, the average pore size and the through hole The rate will gradually decrease.