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一九八一年,日本国际贸易部和工业部(MITI)制定了一项未来工业基础工艺的研究和开发计划。这是一项综合性计划,其中一个方面就是有关未来电子器件的开发。期望到九十年代,电子器件将成为电子工业和机械工业的主导。目前基础工艺的研究和开发正在以下三个主要方面进行:(1)控制原子位置的组成和分布的“超晶格器件”(sur-per-lattice devices);(2)形成多层集成电路的三维集成电路;(3)能在诸如热、辐射、机械震动等恶劣条件下运用的加强集成电路。
In 1981, Japan’s Ministry of International Trade and Industry (MITI) developed a research and development plan for the future industrial base process. This is a comprehensive program, one of which is about the development of future electronic devices. Looking to the nineties, electronic devices will become the dominant electronics and mechanical industries. Current research and development of basic processes are underway in three main areas: (1) “sur-per-lattice devices” that control the composition and distribution of atomic sites; (2) the formation of multi-layer integrated circuits Three-dimensional integrated circuits; and (3) hardened integrated circuits that can be used under harsh conditions such as heat, radiation and mechanical shocks.