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本文对Ag-Cu-Sn系低银钎料进行了研究。研究表明,用Ag-Cu-Sn相图中富铜一角、银含量为15～25％,液相线温度在725～825℃之间的合金钎焊低碳钢时,其组织中的δ相及合金中的锡含量对钎焊接头的剪切强度均有影响。本文研制了一种Ag-Cu-Sn系低银钎料,并发现,在钎料中添加2～3％Mn可成倍地增加钎料在低碳钢上的润湿面积,添加2％Ni可改善合金组织,降低其硬度,添加0.2～0.5％Si时,Si的作用较复杂。
In this paper, Ag-Cu-Sn low silver solder has been studied. The results show that δ-phase and δ-phase in brazing of mild steel with Ag-Cu-Sn phase rich in copper, 15-25% of silver, and liquidus temperature of 725-825 ℃ The tin content of the alloy has an impact on the shear strength of the brazed joints. In this paper, a kind of Ag-Cu-Sn low silver solder was developed. It was found that the addition of 2 ~ 3% Mn in the solder could increase the wetting area of the filler metal on the mild steel by a factor of 2. Adding 2% Ni Can improve the alloy structure, reduce its hardness, adding 0.2 ~ 0.5% Si, the role of Si more complicated.