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介绍了自行研制的高密度封装外壳设计软件、阐述了其工作原理和功能。应用该软件设计并制作出目前国内最多针脚数的外壳ＰＧＡ２５７。
Introduced the self-developed high-density package shell design software, described its working principle and function. Application of the software design and produce the most number of pin shell PGA257.