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使用Al_2O_3作为集成电路的表面钝化,在国内外很长时间以来都获得了广泛的重视。然而,我们过去对采用Al_2O3。作为集成电路钝化,始终停滞在少量试验阶段。其原因是经阳极氧化后的硅片给划片带来较大的困难,而且用真空吸片非常繁锁,加上大马力的机械泵在清洁工艺线上使用油蒸汽污染严重。因此,我们从去除机械泵吸气着手,力求投入批量生产。我们摸索了阳极氧化的规律,改进了装置硅片的方法,试行用金属鲤鱼夹子夹持硅片进行阳极氧化。经过一年多的观察使用,证明这种方法简单易行,效果良好,用这种方法钝化的5G24通用型集成运放已顺利通过了各种苛刻的可靠性试验及抗辐射试验,并已用于国防工程项目。令人感兴趣的是这种方法能投入大批量生产,目前的生产量已能每小时生产40大圆片,且有潜力可挖。在解决批量生产的同时,我们又进一步解决了划片问题。
The use of Al 2 O 3 as the surface passivation of integrated circuits has gained a great deal of attention at home and abroad for a long time. However, we used to use Al 2 O 3. Passivation as an integrated circuit, has always been stuck in a small number of pilot phase. The reason is the anodized silicon to dicing caused greater difficulties, but also very complicated with vacuum suction, coupled with high-powered mechanical pump in the cleaning process using oil vapor pollution is serious. Therefore, we started with the removal of mechanical pumps and tried to put them into mass production. We explored the law of anodization and improved the method of mounting the silicon wafer. We tried to anodize the silicon wafer with a metal carp clip. After more than one year of observation and use, this method proved to be simple and effective, and the passivated 5G24 universal integrated operational amplifier has passed various harsh reliability tests and radiation tests in this way. For national defense projects. Interestingly, this method can be put into mass production, the current production has been able to produce 40 wafers per hour, and has the potential to dig. While solving the mass production, we further solved the dicing problem.