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本文介绍一种测量金属化陶瓷管壳热阻的方法,测定了几种管壳的热阻。文中介绍的方法模拟了集成电路实际工作状态的散热条件,因而提供的结果对于大规模集成电路封装外壳的热设计是有用的。
This article describes a method for measuring the thermal resistance of a metallized ceramic tube, measuring the thermal resistance of several tube shells. The method described in this article simulates the thermal conditions under which ICs actually operate, providing results that are useful for the thermal design of large scale IC package housings.