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采用电子背散射衍射(EBSD)技术研究了冷轧变形(90%)CoCrFeMnNi高熵合金在800℃退火再结晶过程中的晶界特征分布(GBCD)。结果表明,退火0.08 h后,合金发生初次再结晶,组织中形成高达56.92%的低∑重合位置点阵(CSL)晶界,其中∑3晶界和∑9+∑27晶界的比例分别为53.04%和2.12%,且大部分低∑CSL晶界处于大角度晶界网络上,打破了大角度晶界网络连通性,其GBCD得到优化。延长退火时间(0.08~10 h),合金晶粒异常长大至二次再结晶完成,强α-{110}织构所占体积分数从49.53%增大至66.65%;低∑CSL晶界的总比例和∑3晶界的比例均下降,∑9+∑27晶界比例先上升后下降,大角度晶界网络连通性逐渐趋于完整。与此同时,该合金的维氏硬度与其再结晶晶粒尺寸满足Hall-Petch关系。
The grain boundary characteristic distribution (GBCD) of the cold-deformed (90%) CoCrFeMnNi high-entropy alloy during annealing recrystallization at 800 ℃ was studied by using electron backscatter diffraction (EBSD) technique. The results show that for 0.08 h annealing, the alloy recrystallizes for the first time and forms a low Σ coincidence lattice (CSL) grain boundary up to 56.92%. The proportions of Σ3 grain boundary and Σ9 + Σ27 grain boundary are 53.04% and 2.12%, respectively, and most of the low ΣCSL grain boundaries are in the large-angle grain boundary network, which breaks the connectivity of the large-angle grain boundary network and the GBCD is optimized. Extending the annealing time (0.08-10 h), the alloy grains grow abnormally until the secondary recrystallization is completed, the volume fraction of strong α- {110} texture increases from 49.53% to 66.65%, and the low ΣCSL grain boundaries The ratio of total grain size and Σ3 grain boundaries all decreased. The proportion of Σ9 + Σ27 grain boundaries first increased and then decreased, and the connectivity of large-angle grain boundaries gradually became complete. At the same time, the Vickers hardness of the alloy and its recrystallized grain size satisfy the Hall-Petch relationship.