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LAM Research公司宣布推出其首台设计用于三维(3D)IC硅通孔刻蚀用途的300mm230Syndion刻蚀设备。该公司声称他们是首家出台硅通孔刻蚀用300mm刻蚀设备的供应厂家。这台Syndion刻蚀设备业已验证具有用于大面积集成电路的刻蚀能力,在300mm的晶圆上,刻蚀均匀性优良。该设备还腐蚀
LAM Research Corporation announces the first 300mm230Syndion etching device designed for 3D through silicon via etching. The company claims they are the first supplier to introduce 300mm etching equipment for through-silicon via etching. The Syndion etching equipment has been proven to have etch capability for large area integrated circuits, with excellent etch uniformity on 300mm wafers. The device is also corroded