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采用循环伏安法和计时安培法研究了CuCl2硅溶胶和水溶液中铜在玻碳电极上的电沉积和电结晶行为.结果表明在两种CuCl2电解质中,铜的电沉积分两个步骤完成,Cu2+还原为Cu+在硅溶胶中较水溶液中容易;采用吸附-成核模型解析电流-时间暂态曲线,并确定铜的电结晶机理为扩散控制下的连续成核三维生长(3DP),Cu2+在水溶液中的扩散系数较硅溶胶中的大,但相同电位下在硅溶胶中的饱和成核数密度高于水溶液中.
The cyclic voltammetry and chronoamperometry were used to study the electrodeposition and electrocrystallization behavior of copper in CuCl2 and aqueous solution at glassy carbon electrode.The results showed that electrodepositing of copper was completed in two steps in the two CuCl2 electrolytes, The current-time transient curves were analyzed by adsorption-nucleation model and the electrocrystallization mechanism of Cu2 + was confirmed to be continuous nucleation 3DP under diffusion control. The Cu2 + The diffusion coefficient in aqueous solution is larger than that in silica sol, but the saturation nucleation number density in silica sol at the same potential is higher than that in aqueous solution.