论文部分内容阅读
半导体组装业正在红火起来,随着芯片销售量的快速增长,越来越多的芯片制造商正把芯片后道工序的加工转包给独立承包商,以便他们能把所有的资金和能力投向需求正旺而费用昂贵的芯片制造的前道工序中去。虽然芯片组装业越来越红火,但同时也变得更加复杂。有许多新的激动人心的封装技术,而每一种新技术又各有其优点和短处,这些技术正在力争获得人们的注意,并在印制电路板方面获得一席之地。同时,用户对组装专业人员的依赖不单单要做工作,而且要帮助找出作好组装工作的最好方法。而在相反的趋势中,组装承包商开始发现垂直集成于引线框架中,测试以及甚至制造周期的结束都是一个引人注目的课题。为了在这纷乱中理出头绪,《亚洲电子导报》记者采访了亚洲一些大的组装承包公司的负责人,就组装业的技术、行业发展模式、资金及生产选址等进行了采访。这些负责人的回答体现了组装业萌发出的潜力以及潜在的困难,同时还展出现了封装行业的未来,我们在此以非正式讨论的形式编写出来,以飨读者。
Semiconductor assembly industry is booming, with the rapid growth of chip sales, more and more chip manufacturers are the process of chip subcontracting subcontracted to an independent contractor, so that they can put all the money and ability to demand The prosperous but expensive chip manufacturing process to go. Although the chip assembly industry more and more prosperous, but also become more complicated. There are many new and exciting packaging technologies, and each new technology has its own advantages and disadvantages, these technologies are striving to gain people’s attention and gain a place in the printed circuit board. At the same time, the user’s reliance on assembly professionals does more than just work, but also helps identify the best way to do the assembly work. In the opposite direction, assembly contractors began to find the vertical integration in the leadframe, testing and even the end of the manufacturing cycle is a compelling issue. In order to make sense of this chaos, the Asia Electronics Herald reporter interviewed the heads of some of the largest assembly contractors in Asia and interviewed on the assembly technology, industry development model, capital and production site selection. The answers from these executives reflect the potential and potential difficulties in the assembly industry, along with the future of the packaging industry, where we write in an informal discussion to readers.