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采用真空热压烧结工艺制备W(50)/Cu-Al2O3复合材料,观察了其显微组织,测试了其致密度、硬度、抗弯强度和导电率。结果表明:W(50)/Cu-Al2O3复合材料组织致密;致密度和硬度优于Cu-50%W,致密度可达99.8%,显微硬度达135 HV。而导电率为46%IACS,略低于W-50%Cu复合材料。抗弯强度为291.3 MPa,弥散铜钨合金室温弯曲断裂主要以弥散Cu相的撕裂为主,伴随有W-Cu界面的分离和部分W晶粒的解理断裂。
The W (50) / Cu-Al2O3 composite was prepared by vacuum hot-pressing sintering process. The microstructure was observed and its density, hardness, flexural strength and electrical conductivity were tested. The results show that the microstructure of W (50) / Cu-Al2O3 composite is dense, the density and hardness are better than that of Cu-50% W, the density is up to 99.8% and the microhardness is up to 135 HV. The electrical conductivity was 46% IACS, slightly lower than the W-50% Cu composite. The flexural strength is 291.3 MPa. The bending fracture at room temperature of the dispersed Cu-W alloy is dominated by the tear of the dispersed Cu phase accompanied by the separation of the W-Cu interface and the cleavage fracture of some of the W grains.