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含>NH、—NH_2、>S配位基树脂与Cu(Ⅱ)、Ag(Ⅰ)、Au(Ⅱ)、Pd(Ⅳ)和Pt(Ⅳ)离子络合时,配位原子S除提供电子形成配价键之外,与这些金属离子络合时都存在着不同程度的反馈键,我们用ESCA对此树脂与这些离子的络合状态进行了表征。结果表明:这些金属离子的络合容量随反馈键数量的增加而增加,而参与络合的N原子总是提供电子对形成配键。
In complexation with Cu (Ⅱ), Ag (Ⅰ), Au (Ⅱ), Pd (Ⅳ) and Pt (Ⅳ) ions containing> NH, -NH_2 and> S ligands, In addition to the formation of valence bonds, there are different degrees of feedback bonds when complexed with these metal ions. We used ESCA to characterize the complexation of these resins with these ions. The results showed that the complexing capacity of these metal ions increased with the increase of the number of feedback bonds, while the N atoms involved in the complexing always provided electron pair formation bonds.