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基于具体案例分析,介绍了超声波无损检测技术在半导体工艺中的应用。采用回声法和穿透法检测了封装体件内部塑封界面的裂纹、封装体底部填充胶的孔洞以及硅通孔的成型质量。通过声波成像原理和实例分析的比对结果表明,穿透法适合快速判断封装体是否发生失效,而回声法则适合逐层检测缺陷的位置。对于某些封装体内部深层次的缺陷,需要对比回声法和穿透法的整体成像来完成失效判断。对于某些半导体工艺的质量,需要运用回声法的时间记录模式来完成质量分析,其深度检测的误差可以控制在5%以内。
Based on the specific case analysis, the application of ultrasonic non-destructive testing technology in semiconductor process is introduced. Echo method and penetration method were used to test the crack of the plastic interface inside the package body, the hole filling the bottom of the package body and the forming quality of the TSV. The comparison between the acoustic imaging theory and the example shows that the penetrating method is suitable for quickly judging the failure of the package, while the echo method is suitable for detecting the position of the defect layer by layer. For some deep-level defects inside the package, it is necessary to compare the overall imaging of the echo method and the penetration method to complete the failure judgment. For some semiconductor process quality, you need to use the echo time recording mode to complete the quality analysis, the depth of detection error can be controlled within 5%.