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本文采用MW—EFO金属丝形球装置与JWYH—2型超声热压金丝球焊机进行了φ35μm的纯铜丝的球焊键合试验。对铜丝在不同的超声键合功率及超声作用条件下球焊焊点的拉脱力进行了测定,试验结果表明,铜丝球焊具有较高的键合强度,其焊点拉脱力最高可达20克,这一结果明显优于金丝球悍的焊点强度。本文还用扫描电镜对铜丝球焊焊点的形貌进行了观察分析。
In this paper, MW-EFO wire ball device and JWYH-2 ultrasonic hot press gold wire ball welding machine φ35μm pure copper wire ball bonding test. The pull-off force of the ball joint under different ultrasonic bonding power and ultrasonic action was tested. The experimental results show that the copper wire ball joint has high bonding strength and the highest pull-off force of the joint 20 grams, this result is obviously superior to the gold ball toughness of the solder joint strength. In this paper, we also use scanning electron microscopy to observe and analyze the shape of the copper ball weld.