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小型空间相机的电子、光学和机械器件高度集成于狭小空间,相机成像质量受电子器件发热及机械部件传导入的外热流影响。为确保相机在轨正常运行并拥有较高的成像品质,需要对相机热控设计。对相机各种传热环节进行了详细的设计分析,并通过外热流分析确定辐射散热面,建立了热仿真模型。运用阻容方法分析传导路径上的热阻及热容,证明内部热容可以应对FPGA芯片的短时间功率增加。热平衡试验证明采用的热设计手段可以保证小相机的正常工作。
Small space camera electronic, optical and mechanical devices are highly integrated in a small space, the camera image quality by electronic devices and mechanical components into the external heat flow effects. In order to ensure that the camera is running on the track and has a high imaging quality, thermal control of the camera is required. A detailed design and analysis of the various heat transfer aspects of the camera were carried out, and the radiant heat dissipation surface was determined by external heat flux analysis. A thermal simulation model was established. Using the RC method to analyze the thermal resistance and heat capacity of the conduction path, it is proved that the internal heat capacity can cope with the short-term power increase of the FPGA chip. Thermal balance test proved that the thermal design method used to ensure the normal operation of small cameras.