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随着微波功率放大器热功耗的增加和小型化,如何改善散热问题变得越来越重要,理想的热设计能够保证放大器长期工作。放大器在真空环境下以热传导和辐射散热为主,嵌入在盒体底部的热管具有很高的热传导率。放大器产生的热量以传导的方式传到盒体和热管,热管迅速把热量传导到散热器上,散热器的翅片通过辐射把热量散发出去。论述了在真空环境下微波功率放大器热管散热的设计方法,用ICEPAK CFD热分析软件进行热仿真。微波放大器通过热真空试验,可以工作正常,实验表明热管散热是真空环境下大功率放大器热设计的有效方法。
With the microwave power amplifier thermal power consumption increase and miniaturization, how to improve the cooling problem becomes more and more important, the ideal thermal design can ensure the long-term operation of the amplifier. Amplifier in a vacuum environment to heat conduction and radiation heat-based, embedded in the box at the bottom of the heat pipe has a high thermal conductivity. The heat generated by the amplifier is transmitted to the box body and the heat pipe in a conductive manner. The heat pipe rapidly transfers the heat to the radiator, and the radiator fin emits heat by radiation. The design method of heat dissipation of microwave power amplifier heat pipe in vacuum environment is discussed. Thermal simulation is carried out by ICEPAK CFD thermal analysis software. Microwave amplifiers through the thermal vacuum test, you can work properly, experiments show that the heat pipe heat is a vacuum environment, high-power amplifier thermal design an effective method.