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在制造挠性印制电路板用的挠性覆铜箔层压板的工艺过程中,为了提高线路图形用铜箔与绝缘基材聚酰亚胺薄膜的粘接性,研究开发了专用的表面处理技术和压制成型技术,制成了无卤素、两层结构型粘接性良好的挠性覆铜板;在线路图形表面的保护涂敷材料方面,研发了无机填料的处理技术,用少量的阻燃性填料即可使环氧树脂得出必要的阻燃性,保证了涂层的柔韧性;这两方面的技术促成了完全无卤素型印制电路板的产生。
In the process of manufacturing a flexible copper-clad laminate for a flexible printed circuit board, in order to improve the adhesion between the copper foil for circuit patterns and the polyimide-based insulating substrate, a special surface treatment Technology and compression molding technology, made of halogen-free, two-layer structure of good adhesion of flexible copper clad laminate; in the protection of the circuit surface coating material, developed inorganic filler processing technology, with a small amount of flame retardant Flake fillers provide epoxy resin with the necessary flame retardancy to ensure coating flexibility; these two technologies have led to the production of completely halogen-free printed circuit boards.