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采用不同粒径Ni粉与硅橡胶(110型)按质量比2.8∶1制成Ni/硅橡胶复合材料,测量其压敏导电性及介电性质。结果表明,填料粒径<300 nm的Ni/硅橡胶复合材料导电压敏性显著减小,交流电导率、介电常数、介电损耗也变小,且随频率基本没有变化。当粒度很小时,金属颗粒会由导体向绝缘体转变且与温度有关。实验表明,常温下金属镍粉在亚微米尺度就会有显著的小尺寸效应。金属高分子复合材料的研究为探讨金属填料的小尺寸效应提供了一种简便、有效的方法。
Ni / Silicone rubber composites with different particle sizes of Ni powder and silicon rubber (Type 110) were prepared at a mass ratio of 2.8: 1, and their pressure-sensitive conductivity and dielectric properties were measured. The results show that the conductivity of Ni / Silicone rubber composites with filler particle size <300 nm is significantly reduced, AC conductivity, dielectric constant and dielectric loss are also reduced, and the frequency dependence is almost unchanged. When the particle size is small, the metal particles will transition from the conductor to the insulator and depend on the temperature. Experiments show that at room temperature metal nickel powder in the sub-micron scale will have a significant effect of small size. Metallic polymer composites provide a simple and effective method to explore the small size effect of metal fillers.