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高密度互连用环氧树脂基覆铜板体系成型工艺的研究/李雪;梁国正/苏州大学材料工程,2011硕士论文摘要:随着电子和电气设备向轻薄短小、多功能化和智能化方向发展以及电子封装技术的不断进步,以导通孔微小化、导线精细化和介质层薄型化为技术特征的高密度互连印制线路板(HDI)产品迅速兴起,并逐步成为新一代印制线路板的主流。HDI板通常采用积层法(build-up)制造,即以双层或四层板为
High-density interconnect systems with epoxy-based CCL molding process / Li Xue; Liang Guozheng / Materials Engineering, Soochow University, 2011 Master’s thesis Abstract: With the electronic and electrical equipment to the thin, light weight, multi-functional and intelligent direction With the continuous development of electronic packaging technology, high-density interconnect printed circuit board (HDI) products featuring miniaturization of vias, thinning of the wires and thinning of the dielectric layer are rapidly emerging and have gradually become a new generation of printed The mainstream of the circuit board. HDI boards are usually built using build-up, that is, double or four-layer boards