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当前印刷电路板呈现出两大趋势,即应用于较高的工作频率和装配中使用无铅焊,因此对介电材料的要求更苛刻,主要表现在:低介电常数、低介电损耗、高使用温度、低吸水性。热塑性材料——聚苯醚(PPE)的使用被证明能有效地提升热固性材料的性能,如优秀的耐水解性能、低吸水性、极高的玻璃化温度、在较宽的温度和频率范围内杰出的电性能,以及无需卤素阻燃剂就可达到良好的阻燃性能。研究显示,在热固性材料中使用热塑性材料,充分固化后的材料可取得多种的相态,分子交联网络结构呈现出复杂性。据报道,在广泛增强介电材料性能的材料研究中,多官能团聚苯醚低聚体取得了突破性进展。这种多官能团聚苯醚低聚体作为大分子单体可和环氧树脂反应并提升其多种性能。
Current printed circuit boards present two major trends that apply to higher operating frequencies and the use of lead-free solder in assemblies, thus requiring more stringent dielectric requirements, primarily in the areas of low dielectric constant, low dielectric loss, High temperature, low water absorption. The use of thermoplastic materials, polyphenylene oxide (PPE), has proven to be effective in enhancing the properties of thermosets such as excellent hydrolysis resistance, low water absorption, very high glass transition temperature, wide temperature and frequency range Outstanding electrical properties, as well as without the need for halogen flame retardants can achieve good flame retardant properties. Studies have shown that the use of thermoplastics in thermosetting materials, the fully cured material can take a variety of phases, the molecular structure of the cross-linked network presents complexity. It has been reported that multifunctional polyphenylene ether oligomers have made a breakthrough in materials research that greatly enhances the properties of dielectric materials. This polyfunctional polyphenylene ether oligomer as a macromonomer reacts with the epoxy resin and enhances its various properties.