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据美刊“Electronic Design”Vol.23,No.17(1975年8月16日)一期报道:美国的许多半导体公司正在加速研制新的逻辑电路。目前研制工作集中在三个方向上:一个是MOS型及双极型微处理机与外围电路,一个是专用的LSI电路,再一个是用户可编程序的PLA及ROM。并取得了如下主要进展:(1)新研制成的双极型按位划片的微处理机速度已有提高,字长也有增加;(2)初露头角的双极型LSI电路系列速度快,适应性强,复杂性高,可适应于小到微型计算机、大到主机的范围;(3)出现了现场可编程序的PLA(程序逻辑矩阵),这比PROM要有效得多,从而取代硬连逻辑。
According to the American publication “Electronic Design” Vol.23, No.17 (August 16, 1975) A report: Many semiconductor companies in the United States are accelerating the development of new logic circuits. At present, research and development work is focused on three directions: one is a MOS type and a bipolar type microprocessor and a peripheral circuit, one is a dedicated LSI circuit, and the other is a user-programmable PLA and a ROM. And made the following major advances: (1) newly developed bipolar bit-slicing microprocessor speed has increased, the word length has also increased; (2) budding bipolar LSI circuit series, fast, adaptive Strong and complex, adaptable to the range of as small as a microcomputer and as large as a host computer. (3) There is a field programmable PLA (program logic matrix) which is much more efficient than a PROM, logic.