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概述了利用Cu_2O(I)胶体铜的非导体表面直接电镀工艺,适用于迅速、安全和经济地制造孔金属化印制板。
The non-conductor surface direct plating process using Cu 2 O (I) colloidal copper is outlined, making it ideal for the rapid, safe and economical manufacture of metallized metallization.