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针对溅射离子镀离化率低及多弧离子镀易产生微米级熔滴喷溅这一长期制约离子镀技术发展的难题,依据金属靶材内部电子在通过电阻值较大的组织缺陷处会导致该区域温度上升的焦耳热效应和金属表面高温下电子热发射等物理学现象,建立以离子碰撞和靶材热发射为脱靶机制的新型微弧离子镀技术。通过氩离子的轰击动能和金属靶材内电流的焦耳热效应共同促使靶面缺陷处温度迅速上升,增加了该区域内电子和原子的动能使其能够克服表面势垒从靶材表面大量逸出。等离子区内靶材原子和电子数量的增加提高了镀料粒子的碰撞离化率,且靶面未出现明显电弧避免了靶材表面的熔融喷溅,从而获得高离化率和高密度的镀料粒子。实验结果表明:微弧离子镀技术制备的TiN薄膜具有致密的结构、良好的表面质量、较高的显微硬度、较强的膜基结合力和良好的抗腐蚀性能。
In view of the sputtering ion plating rate is low and multi-arc ion plating easy to produce micron droplet splashing the long-term restrictive ion plating technology development challenges, based on the metal target within the electron through the resistance value of the larger tissue defects will Joule heating effect caused by temperature rise in this area and electronic heat emission under high temperature of metal surface are also discussed. A new micro-arc ion plating technology is proposed to take ion collision and target heat emission as off-target mechanism. Argon ion bombardment kinetic energy and metal target current Joule heating effect together to promote the rapid increase of the temperature of the target surface defects, increasing the kinetic energy of electrons and atoms in the region to overcome the surface potential barriers to escape a large number of target surface from the target. Increasing the number of atoms and electrons in the plasma region of the target increases the collision ionization rate of the plated particles, and no obvious electric arc occurs on the target surface to avoid melt splatter on the target surface to obtain high ionization rate and high-density plating Material particles. The experimental results show that the TiN thin films prepared by micro-arc ion plating technology have a compact structure, good surface quality, high microhardness, strong film-based bonding strength and good corrosion resistance.