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基于Z-pins增强陶瓷基复合材料层间Ⅰ型断裂韧性的试验结果、Z-pins增强机理,提出了Zpins拔出的单线性软化模型.重点考虑了Z-pins直径范围内拔出位移的不一致性,在简单双悬臂梁(DCB)理论的基础上,获得了Z-pins增强陶瓷基复合材料层间Ⅰ型开裂性能的分析预测模型,预测结果与试验结果吻合较好.在此基础上,采用预测模型获得了不同Z-pins直径、裂纹长度下的裂尖能量释放率,并与理想弹簧元法进行了比较.结果表明:当裂尖靠近Z-pins时,随着Z-pins直径增大,两种方法所得的裂尖能释放率的差异逐渐增大,但总体来说差异的量级很小;随着裂纹长度的增加,裂尖逐渐远离Z-pins,两种方法所得的裂尖能释放率的存在较大的差异,不能忽略Z-pins直径范围内拔出位移不一的影响.
Based on the experimental results of the Z-pins reinforced type Ⅰ fracture toughness between ceramic matrix composites and the enhancement mechanism of Z-pins, a single linear softening model of Zpins pull-out was proposed. The disagreement of pull-out displacement in Z-pins diameter was considered On the basis of the simple double-cantilever beam (DCB) theory, an analytical predictive model of type Ⅰ cracking behavior between Z-pins reinforced ceramic matrix composites was obtained. The predicted results are in good agreement with the experimental results. On this basis, The predicted energy release rates at different Z-pins diameters and crack lengths were obtained and compared with the ideal spring-element method. The results show that when the crack tip approaches the Z-pins, Large, the difference between the two methods obtained crack tip energy release rate gradually increased, but in general the magnitude of the difference is small; as the crack length increases, the crack tip away from the Z-pins, the two methods There is a large difference in the tip release rate and can not ignore the effect of different displacement displacements within the diameter range of the Z-pins.