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引言在整机研究所里,为配合专题研究或新电子设备的研制,需要一些非标准的薄膜电路,而且要求品种多、质量高,但数量少。大家知道,封装是保证产品质量的重要手段之一。而塑料封装具有外形设计灵活、所需设备简单、成本低等优点。因此我们采用618环氧树脂与甲基嵌段硅橡胶的混合料作灌封材料。多年的试验和实践证明,用这种混合料作灌封料是较为满意的。
INTRODUCTION In the complete machine institute, some special non-standard thin-film circuits are required to cooperate with the special research or the development of new electronic equipment, and require more varieties, higher quality and fewer quantities. We all know that packaging is one of the important means to ensure product quality. The plastic package has the shape design flexibility, the required equipment is simple, low cost and so on. Therefore, we use 618 epoxy resin and methyl-block silicone rubber mixture for potting material. Years of experiments and practice have proved that using this mixture as potting material is more satisfactory.