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多层印制板为了提高层间结合力 ,我们采用内层板黑化处理工艺。1 工艺流程除油→两道水洗→弱腐蚀 ( 2～ 3) μm→两道水洗→酸洗→两道水洗→黑化处理。2 黑化工艺配方Na Cl O2 30～ 35g/L;Na OH5～ 1 2 g/L;Na3PO45～ 1 2 g/L;温度 90°C;时间 3min。3 工艺说明( 1 )经过
Multilayer PCB In order to improve the bonding between the layers, we use the inner layer blackening process. 1 process degreasing → two washing → weak corrosion (2 ~ 3) μm → two washing → pickling → two washing → blackening treatment. 2 blackening formula Na Cl O2 30 ~ 35g / L; NaOH5 ~ 1 2 g / L; Na3PO45 ~ 1 2 g / L; temperature 90 ° C; time 3min. 3 Process Description (1) After