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导热聚合物在微电子封装和电气绝缘等领域获得广泛应用。在聚合物内形成稳定而有效的导热粒子通路，减少声子界面散射和热阻，强化声子传递是改善聚合物热导率的关键。本文分别从导热填料粒子、聚合物基体、界面结构性质、加工工艺等角度探讨了提高和改善聚合物导热性能的方法和途径。
增强聚合物热导率的途径研究
【摘 要】
：
导热聚合物在微电子封装和电气绝缘等领域获得广泛应用。在聚合物内形成稳定而有效的导热粒子通路，减少声子界面散射和热阻，强化声子传递是改善聚合物热导率的关键。本文分
【机 构】
：
西安科技大学化学与化工学院 西安 710054
【出 处】
：
第二届中国国际复合材料科技大会 (CCCM-2)
【发表日期】
：
2015年期
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