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Charging of insulating substrates is a common problem during electron beam lithography (EBL) exposure, which deflects the beam and distorts the pattern.A lot of efforts have been done in order to overcome surface charging effects, such as to deposit a thin metal layer below or above the resist, or to spin coating a conducting polymer under or over the resist.But accordingly, a lot of problems are open to question to remove the metal thin film or to separate the polymer from the resist.