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  5. Preparation And Characteristics of High Temperature Epoxy-Phenolic Adhesive Film For Bonding Metal A

Preparation And Characteristics of High Temperature Epoxy-Phenolic Adhesive Film For Bonding Metal A

来源 :第七届亚澳复合材料会议 | 被引量 : 0次 | 上传用户：jbl6055871
【摘 要】
：
A family of aluminum powder filled epoxy-phenolic resins were prepared and characterized over a broad range of phenolic/epoxy/aluminum weight ratios.The effect of the filler on the thermal properties
【作 者】
：
Shyi-Liang Jwo Shu-Ling Tseng Jen-Pin Yu Darping Chuang Cheng-Huan Wang 
【机 构】
：
Materials & Electro-Optics Research Division,Chung-Shan Institute of Science & Technology,Tao-Yuan,T
【出 处】
：
第七届亚澳复合材料会议
【发表日期】
：
2010年4期
【关键词】
：
composite epoxy-phenolic adhesive aluminum porta shear 
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　　A family of aluminum powder filled epoxy-phenolic resins were prepared and characterized over a broad range of phenolic/epoxy/aluminum weight ratios.The effect of the filler on the thermal properties of the cured resin was studied by using TGA and the results show that the thermal stability of filled polymer is significantly greater than that of unfilled one.These aluminum filled epoxy-phenolic resins were coated on a glass fabric carrier to form a tape adhesive.
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