【摘 要】
：
High power pulsed magnetron sputtering (HPPMS) is defined as pulsed sputtering where the peak power exceeds the time-averaged power by typically two orders of magnitude. As two important parameters in
【机 构】
：
Key Laboratory of Advanced Technologies of Materials, Ministry of Education of China, School of Mate
【出 处】
：
第十一届全国表面工程大会暨第八届全国青年表面工程学术会议
论文部分内容阅读
High power pulsed magnetron sputtering (HPPMS) is defined as pulsed sputtering where the peak power exceeds the time-averaged power by typically two orders of magnitude. As two important parameters in the definition, the peak power and average power can be modulated effectively by changing voltage, frequency or pulse width, leading to the change of the plasma characteristics. In this paper, Ti films were prepared by HPPMS, and the target current-voltage characteristics and plasma composition were monitored during the deposition. Comparative Study of the effect of peak power and average power on the plasma characteristics and film properties were investigated in detail. It is found that increasing the voltage can significantly increase the peak power, thereby result in a high metal ionization rate. The films tend to exhibit compressive stress, dense and smooth, but a low deposition rate. For increasing the pulse width and frequency, it is beneficial for increasing the average power, thus effectively improving the deposition rate. The films show tensile stress and large grain size, but the surface is rough.
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