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采用扫描电镜和能谱分析等手段研究了3种不同引线框架用铜合金材料与SnAgCu钎料的界面结构,3种铜合金引线框架材料与SnAg3.0Cu0.5焊膏焊后未经时效的界面组织相似。焊点在160℃恒温时效300 h后,Cu-0.1Fe-0.03P合金、Cu-0.36Cr-0.03Zr合金、Cu-0.38Cr-0.17Sn-0.16Zn合金与SnAg3.0Cu0.5焊膏的界面金属间化合物厚度分别为8.7、7.4、6.2μm,其成分主要为Cu6Sn5,靠近铜合金一侧均有少量Cu3Sn生成。结果表明,Cu-0.38Cr-0.17Sn-0.16Zn合金比Cu-0.1Fe-0.03P合金和Cu-0.36Cr-0.03Zr合金具有更好的焊接可靠性能,Cu-0.38Cr-0.17Sn-0.16Zn合金中的Zn元素在焊点界面的富集有效减缓了界面处原子的相互扩散,使金属间化合物的增长速度降低。
The interface structures of three kinds of copper alloy materials for lead frame and SnAgCu solder were studied by scanning electron microscopy and energy spectrum analysis. The interface between the three kinds of copper alloy lead frame materials and SnAg3.0Cu0.5 solder paste after welding Similar organization. After the solder joints were aged at 160 ℃ for 300 h, the interface of Cu-0.1Fe-0.03P alloy, Cu-0.36Cr-0.03Zr alloy, Cu-0.38Cr-0.17Sn-0.16Zn alloy and SnAg3.0Cu0.5 solder paste Intermetallic compounds were 8.7,7.4,6.2μm thick, the main component of Cu6Sn5, near the side of the copper alloy are a small amount of Cu3Sn generation. The results show that the Cu-0.38Cr-0.17Sn-0.16Zn alloy has better welding reliability than the Cu-0.1Fe-0.03P alloy and the Cu-0.36Cr-0.03Zr alloy. The Cu- The enrichment of Zn in the alloy at the interface of the solder joint effectively reduces the mutual diffusion of atoms in the interface and reduces the growth rate of the intermetallic compound.