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一、引言对于微波工业来说,封装已成为一个引入注目的领域。到目前为止,电路的复杂性还不需要一个完善的管壳,而是采用逐次接近法来表示设计成效。然而,随着数字领域中带宽和频率(即时钟速率)的增加,很显然,封装常常对器件的电性能、造价和可靠性有较大的影响。因为在各个系统和应用中,封装问题和封装的作用各不相同,所以很难给封装下一个统一的定义。例如:高功率GaAs集成电路与高速数字集成电路对管壳的要求就不一样。虽然作了这些提示,但总还是想对一般管壳下一个定义,并列举出所有管壳的一些一般特性。
I. Introduction For the microwave industry, packaging has become an attractive area. So far, the complexity of the circuit does not need a perfect shell, but the successive approximation method to indicate the effectiveness of the design. However, as bandwidth and frequency (ie, clock rate) increase in the digital domain, it is clear that packaging often has a large impact on the device’s electrical performance, cost, and reliability. Because in various systems and applications, packaging issues and the role of different packages, it is difficult to give the packaging a unified definition. For example: high-power GaAs IC and high-speed digital integrated circuits on the shell requirements are not the same. Despite these hints, it is always the case that we want to define the generic shell and define some of the general characteristics of all shells.