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基于JEDEC标准,采用ABAQUS软件建立了具有5个POP封装组件的三维有限元模型,通过试验验证了模型的准确性,讨论了PCB板阻尼、焊点形状、焊点材料及焊点直径对该封装组件在跌落冲击过程中动态响应的影响.结果表明:POP封装组件关键焊点的最大法向拉应力随PCB阻尼和焊点直径的增大而减小;截顶球形焊点最大法向拉应力都大于柱形焊点的最大法向拉应力;无铅焊料焊点最大拉应力大于锡铅焊料焊点最大拉应力,而对于无铅焊料,角焊点最大拉应力随着含锡量的增加而减小.
Based on the JEDEC standard, a three-dimensional finite element model with five POP package components was established by ABAQUS software. The accuracy of the model was verified through experiments. The effects of PCB damping, solder joint shape, solder joint material and solder joint diameter on the package The results show that the maximum normal tensile stress of the key solder joints of POP package decreases with the increase of PCB damping and solder joint diameter. The maximum normal tensile stress of the truncated spherical solder joints Are greater than the maximum normal tensile stress of the columnar solder joint; the maximum tensile stress of the solder joint of lead-free solder is greater than the maximum tensile stress of solder joint of tin-lead solder, while for lead-free solder, the maximum tensile stress of fillet solder joint increases with the increase of tin content And reduce.