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象硅晶片制造商那样,出现了由 PCB 制造商所采纳并分工协同来推行这种技术。由于用户对便携性的强烈要求,因而对功率、可维护性、功能特性和重量等方面把电子工业推向到新的时代。这个时代将改变着互连技术的等级(水平),包括硅晶片制造、PCB制造、机架(壳)的屏蔽直至大尺寸芯片所采用的冷却方法。在讨论这些新的要求中,出现了制造商分工协同工作。为了制造先进的半导体互连的金属化要
Like silicon chip makers, there has been adoption by PCB manufacturers and division of labor to promote this technology. Due to strong user portability requirements, the electronics industry is being pushed to a new era in terms of power, maintainability, features and weight. This era will change the level of interconnection technology (level), including the manufacture of silicon wafers, PCB manufacturing, shelves (shelves) shielding until large-size chips used in cooling methods. In discussing these new requirements, there has been a synergy between manufacturers. In order to create advanced semiconductor interconnect metallization to be