论文部分内容阅读
目前,将聚酰亚胺类树脂材料用作多层布线层,在晶体管与集成电路中已经实用化。如若应用这种树脂将晶体管作成二层布线,由于广泛采用焊基,易于实现键合自动化,芯片面积也可缩小。在 IC 中,由于表面平坦,布线不发生断线,易于实现多层化。另外,由于膜厚达4微米程度时布线电容下降,据说可以发挥逻辑 IC 高速化的威力。新的树脂与以往的聚酰亚胺相比不但杂质含量极少,而且改善了直至500℃的耐高温性能。这种树脂作为表面保护膜也具有良好的性能。
Currently, polyimide-based resin materials are used as a multilayer wiring layer and have been put into practical use in transistors and integrated circuits. If the application of this resin will be made of two-transistor wiring, due to the widespread use of solder, easy to automate the bonding, the chip area can be reduced. In the IC, because the surface is flat, wiring does not break, easy to achieve multi-layer. In addition, since the wiring capacitance drops when the film thickness reaches 4 μm, it is said that the power of the logic IC can be accelerated. Compared with the previous polyimides, the new resins not only have very little impurity content but also improve the high temperature resistance up to 500 ° C. This resin also has good properties as a surface protection film.