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研究了钨铜材料的热等静压处理。试验材料为W—Cu40。热等静压前,它是通过混合、压制成型,预烧结和熔渗铜制得。热等静压在低于铜的熔点和90—100MPa压力下进行。测定了热等静压前后坯料和试样的密度、硬度、抗弯强度和导电率。证明,热等静压可使W—Cu40坯料的密度从12.7—12.8g/cm~3达到13.2—13.3g/cm~3,接近完全致密化,它消除了熔渗状态的缩孔、疏松和熔渗不良等缺陷,从而提高和改善了硬度、强度和导电度等性能,试验亦表明,W—Cu20材料的热等静压亦有良好效果。
The hot isostatic pressing of tungsten and copper materials was studied. The test material is W-Cu40. Before hot isostatic pressing, it is prepared by mixing, press-forming, presintering and infiltrating copper. Hot isostatic pressing at a temperature below the melting point of copper and 90-100MPa pressure. The density, hardness, flexural strength and electrical conductivity of the ingot and sample before and after hot isostatic pressing were measured. It is proved that the hot isostatic pressing can make the density of W-Cu40 blank reach 13.2-13.3 g / cm ~ 3 from 12.7-12.8 g / cm ~ 3, which is close to complete densification, which eliminates the shrinkage cavities, looseness and Infiltration imperfections and other defects, thereby improving and improving the hardness, strength and electrical conductivity and other properties, the test also showed that the W-Cu20 material HIP also has good results.