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采用半导体激光软钎焊和红外再流焊对QFP256和0805片式电阻进行钎焊试验,研究了SnAgCuCe焊点的力学性能、热疲劳寿命以及显微组织。结果表明,在激光再流焊条件下,激光输出功率对SnAgCuCe焊点的力学性能存在显著影响,且存在最佳值。在热循环载荷作用下,随着热循环次数的增加两种焊接方式下焊点的力学性能均呈明显下降趋势,SnAgCuCe激光再流焊焊点的疲劳寿命明显高于SnAgCuCe红外再流焊焊点,主要是因为激光快热/快冷导致焊点内部物相尺寸较小,组织明显细化。
The soldering experiments of QFP256 and 0805 chip resistors were conducted by using semiconductor laser soldering and infrared reflow soldering. The mechanical properties, thermal fatigue life and microstructure of SnAgCuCe solder joints were studied. The results show that under laser reflow conditions, the laser output power has a significant effect on the mechanical properties of SnAgCuCe solder joints, and there is the best value. With the increase of thermal cycles, the mechanical properties of solder joints under both heat and welding cycles show a significant decrease with the increase of thermal cycling loads. The fatigue life of SnAgCuCe reflow solder joints is significantly higher than that of SnAgCuCe IR reflow solder joints , Mainly because the laser fast hot / cold lead to solder pieces internal phase size smaller, the organization significantly refined.