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近些年来,无铅低熔点填料日渐引起人们的兴趣,且将得到广泛的应用。Cu-Zn-Sn合金正是无铅低熔点填料的一种基本合金。该体系相图虽有一些报道,但他们的研究只涉及富铜区(>50Wt％)的液相限和等温截面(500℃)。我们颇感兴趣的富Sn区的液相限,尚未见文献报道,因此测定该体系富Sn区的液相限是必要的。关于Cu-Zn-Sn体系的三个相关二元体系,已有文献报道,也较成熟。对于Cu-Zn体系,富Zn区600℃以下存在两个转熔反应,其转熔点分别为Q(～88Wt％Zn,598℃),W(97.5-98.5Wt％Zn,424℃);Cu-Sn体系富Sn区有一个转熔反应,其转熔点
In recent years, lead-free low melting point filler has aroused people’s interest gradually, and will be widely used. Cu-Zn-Sn alloy is a basic alloy of lead-free low melting point filler. Although there are some reports about the phase diagram of this system, their research only deals with the liquid phase and the isothermal section (500 ℃) of the copper-rich region (> 50Wt%). We have been interested in the Sn-rich liquid phase limit has not been reported, so it is necessary to determine the liquid-phase limit of the Sn-rich region of the system. About the Cu-Zn-Sn system of the three related binary system, has been reported in the literature, but also more mature. For the Cu-Zn system, there are two transformation reactions in the Zn-rich zone below 600 ° C with transition temperatures of Q (~ 88Wt% Zn, 598 ° C) and W (97.5-98.5Wt% Zn, 424 ° C) Sn-rich Sn-based area has a conversion reaction, the melting point