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以低层错能<110>取向单晶银为研究对象,采用EBSD和TEM等技术,系统分析了冷拔变形过程中的宏观裂化、微观裂化和界面失配角分布的变化规律与内在机制。研究结果表明,随应变量的增加,冷拔银单晶的宏观裂化不断加剧,变形带数量增加,宽度和间距减小。当应变量大于0.94时,形成了与冷拔方向平行的纤维状组织。与层错能相近的合金相比,纯金属单晶银的交滑移和攀移的被抑制程度降低,除了变形孪晶,在低层错能的单晶银中还出现大量随机捕捉位错界面和几何必须位错界面。界面失配角分析结果表明,低应变下,变形以位错滑移为主;中等应变下,滑移和孪生相互竞争;高应变下,孪生为主要变形机制。
With the low-level fault energy <110> oriented single crystal silver as the research object, the variation regularities and internal mechanisms of macro-cracking, micro-cracking and interface mismatch angle distribution were systematically analyzed by EBSD and TEM. The results show that macroscopical cracking of cold-drawn silver single crystal increases with the increase of strain, and the number of deformation bands increases and the width and spacing decrease. When the strain is greater than 0.94, a fibrous structure parallel to the cold drawing direction is formed. Compared with alloys with similar stacking faults, the cross-slip and climbing of pure-metal single-crystal silver are suppressed. In addition to deformation twins, a large number of random catching and dislocation interfaces And geometry must be dislocated interface. The result of interface mismatch analysis shows that the deformation is dominated by dislocation slip at low strain, that the slippage and twins compete with each other under medium strain, and twin is the main deformation mechanism under high strain.