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(三)离子轰击效应离子与固体的相互作用以及离子束技术,在其漫长的研究历史中从来没有达到过现在这样广泛应用的程度。在LSI和VLSI的工艺技术中依靠离子和固体相互作用的设备和技术列于表6。可见,利用离子束作为“刀具”或“工具”几乎可以完成集成电路的各种工艺和工序,因此正在设想和发展在一个离子束装置中连续完成包括薄膜制备、微细加工以及随时、“就地”的质量检测和监控的制造集成电路的技术。不少人认为,如果这种“全离子”加工技术获得成功,那么将成为集成电路发展的又一个新的飞跃。
(C) ion bombardment ion-solid interactions and ion beam technology, in its long history of research has never been so widely used today. The devices and techniques that rely on ionic and solid interactions in the LSI and VLSI process technologies are listed in Table 6. It can be seen that the use of ion beam as a “tool” or “tool” can be completed almost IC processes and processes, it is being conceived and developed in an ion beam device, including the continuous completion of film preparation, microfabrication and at any time, “on the spot ”The quality of testing and monitoring of integrated circuit manufacturing technology. Many people think that if this “all-ion” processing technology is successful, it will become another new leap in the development of integrated circuits.