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采用带有同步水淬功能的原位电阻测量装置结合OM、XRD及TEM分析等方法,研究了等温时效处理对Cu-Ni-Si合金电阻及组织的影响。结果表明,Cu-Ni-Si合金时效阶段电阻随时间变化趋势表现为先下降后趋于稳定。随着时效温度的升高,合金电阻在时效初期急剧下降,这是由于时效时沉淀相在过饱和固溶体中析出所致。时效阶段Cu-Ni-Si合金中沉淀析出相为δ-Ni2Si,初始形态为点状,随着时效时间的延长,沉淀析出相长大,形态逐渐变为针状。
The effect of isothermal aging on the electrical resistance and microstructure of Cu-Ni-Si alloy was investigated by in situ resistance measurement with synchronous water quenching and OM, XRD and TEM analysis. The results show that the trend of aging resistance of Cu-Ni-Si alloy with time is as follows: firstly, the resistance tends to be stable at first. With the aging temperature, the alloy resistance sharp decline in the early aging, which is due to aging precipitated phase in the supersaturated solid solution precipitation. The precipitated phase in the Cu-Ni-Si alloy is δ-Ni2Si in the aging stage. The initial morphology is point-like. With the extension of the aging time, the precipitated phase grows long and the morphology gradually becomes acicular.