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拾片头是倒装芯片键合机的关键运动部件之一,需要实现X、Y、Z三个方向的往复快速移动。模态分析是研究拾片头振动特性的基础。利用Pro/E建立拾片头三维模型,保存为.x_t格式后导入ANSYS Workbench12进行计算模态分析,获取拾片头的前10阶固有频率和振型,并对计算结果进行了分析。结果表明:拾片头一阶固有频率为1 455 Hz,远高于拾片头的工作频率,不会产生共振现象,具有较好的动力学特性。
The pick-up head is one of the key moving parts of the flip-chip bonder, and needs to realize reciprocating fast movement in three directions of X, Y and Z. Modal analysis is the basis for studying the vibration characteristics of pick-up heads. Using Pro / E, a three-dimensional model of pick-up head was built, saved as .x_t format and imported into ANSYS Workbench12 for modal analysis. The first ten natural frequencies and mode shapes of the pick-up head were obtained and the results were analyzed. The results show that the first natural frequency of pick-up head is 1 455 Hz, which is much higher than the working frequency of pick-up head. It does not produce resonance and has good dynamic characteristics.