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制备了介孔二氧化硅（SBA‐15），并采用X射线衍射（XRD）和透射电镜（TEM ）进行了结构表征。结果表明，SBA‐15是具有二维六方孔道结构的介孔材料。将SBA‐15和乙烯醋酸乙烯酯橡胶（EVM ）通过湿法混合，以有机过氧化物为硫化剂，制备了EVM／SBA‐15复合材料，研究了复合材料的介电行为、力学性能和热稳定性。结果表明，在EVM中引入SBA‐15，能有效降低橡胶的介电常数，存在二氧化硅份数最佳值。SBA‐15最佳用量为4份，EVM／SBA‐15的介电常数由纯EVM的6．6降低到4．4，降低33％。复合材料的拉伸强度和热稳定性较纯EVM均有显著改善。“,”Mesoporous silica (SBA‐15) was prepared and X‐ray diffraction pattern and transmis‐sion electron micrographs showed well‐ordered hexagonal structure of SBA‐15 .It was blended with ethylene‐vinyl acetate rubber (EVM ) using organic peroxide as vulcanizing agent to prepare series of composites .The morphologies ,dielectric properties ,mechanical properties and thermal stability of composites were investigated .The results showed that the dielectric constant could be reduced to 4 .4 effectively from 6 .6 of EVM with 33% percentage declined when loading 4 phr SBA‐15 ,and mechani‐cal properties and thermal stability of composites were improved .