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一、引言 在电子工业飞跃发展的今天,半导体器件生产已进入了一个崭新的阶段。目前半导体器件生产正朝大规模集成电路、超高频大功率、超高频低噪声方向发展。图形尺寸越来越小,套刻精度越来越高。制版为半导体器件生产的先行。光刻版质量优劣直接影响产品的成品率、稳定性与可靠性。制造高精度、完美、容易套刻的大面积细线条的掩模版已成为半导体器件生产工艺中十分关心的问题。 采用低温汽相淀积氧化铁版是从去年开始的,日趋成熟的新工艺。低温汽相淀积法具有设备简单、经济,适合于批量生产的特点。氧化铁版耐磨,单色光掩蔽性能好。它与铬版比较,具有透明,可以看准套刻、利于制造细线条等优点。低温汽相淀积氧化铁
I. Introduction In the rapid development of the electronics industry today, semiconductor device production has entered a new stage. At present, the production of semiconductor devices is moving toward large-scale integrated circuits, high-frequency high-power, ultra-high frequency low noise direction. Smaller and smaller graphics size, set of engraving accuracy is getting higher and higher. Plate for the production of semiconductor devices first. Photolithography quality directly affects the product yield, stability and reliability. Rectangular masks for manufacturing high-precision, perfect, easy to cover large area thin lines have become a matter of great concern in the semiconductor device manufacturing process. The use of low temperature vapor deposition of iron oxide version is from the beginning of last year, the more mature new technology. Low temperature vapor deposition method has the characteristics of simple and economical equipment suitable for mass production. Iron oxide version of wear-resistant, monochrome photomask performance. It is compared with the chrome plate, with a transparent, you can look at sets of engraving, which will help create thin lines and so on. Low temperature vapor deposition of iron oxide